- Manual Load Single Sided Systems -

SWC 111 - Sawed / Scribed Wafer Cleaner - Single substrates to twelve inches (12") on the diagonal/diameter. Extremely economical, with cleaning by high pressure de-ionized H2O with an optional CO2 re-ionizing unit.

ECC 123 - Expanded Capabilities Cleaner - Single substrates to ten inches (10") on the diagonal/diameter. Capability for additional options such as three dispense arms and heated dispenses for expanded cleaning capabilities.