ProductsSubstrate ETCHing And Photoresist Stripping SystemsWafer, Photomask,
& Substrate
Cleaning Systems
Manual Cleaning
Systems
Automated Cleaning
Systems
Wet Bench / Batch
Cleaning Systems / Alcohol Vapor Dryer
Reionizers & Mixing
Systems
Covered Chuck Spin
Coaters
Photoresist
Developer Stations
ETCH AND STRIP SYSTEM

Ultra T Equipment Precision Cleaning Technology

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High Pressure Cleaning

High Pressure Cleaning

Ultra T Equipment offers High Pressure DI Water Spray Jets to clean a wide variety of substrates. Pressure from 500 to 2000 PSI are applied through Fan Jets or Single Stream Nozzles to remove all stubborn particles. The DI water is usually Re-Ionized to prevent static discharge. Programmable arm control provides a thorough control of the cleaning process.

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Megasonic Cleaning

Megasonic Cleaning

For critical cleaning UTE offers Megasonic solutions for a wide variety of single wafer/substrate applications, ranging from Post CPM (Polish Cleaning, thick resist develop such as SU-8, resist strip, lift off, mask cleaning and post laser cleaning. The operating frequencies range from 400kHz to 3MHz with power density of 0.05 to 2.0 Watts/cm2.

Scrub Brush: Single and Double Sided

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Scrub Brush:  Single and Double Sided
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Scrub Brush:  Single and Double Sided
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Scrub Brush:  Single and Double Sided

UTE offers a variety of brushes, ranging from the single-sided or double-sided rotary to the cylindrical type, with choices of 3 mil nylon bristles to PVA material. DI water and chemicals are dispensed through the brush elements with the brush contact height with the substrate is adjustable. The brush arm is controlled by a stepper motor to guaranty the accuracy of the scrubbing motion (with speed and acceleration programmable).

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Mist or Atomizing Nozzle Cleaning

Mist or Atomizing Nozzle Cleaning

Mist Nozzles provide an efficient cleaning process with a delicate contact with the substrate. A mixture of DI water and Clean Dry Air (or Nitrogen) is dispensed through the nozzle at high velocity to provide a thorough clean. The small droplet sizes of the atomized jet are very efficient in cleaning debris from narrow and deep streets in the substrate.

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Re-ionizing Systems

Reionizing Systems

The drawbacks of using DI water as a cleaning agent are localized surface ionization and primary and secondary damage associated with static discharge (with charges as high as 20,000 volts on the surface of the wafer/substrate). UTE reionizing options use CO2, surfactant, or chemical mixtures to control the resistivity of the cleaning agent.

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In-Line Heaters

In-Line Heaters

UTE in-line heaters are provided for a variety of chemicals and DI water. The operating temperatures are usually maintained around 45°C to 55°C. Heated DI water dispensed prior to the final dry step of a typical cleaning process helps reduce the dry time and eliminates water strains/streaks on the substrate surface.

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In-Line Surfactant Mixer

In-Line Surfactant Mixer

To insure process consistency, UTE offers in-line surfactant mixers housed in a compact cabinet. The concentrated surfactant solution is mixed with incoming DI water through a metering pump at pre-set concentration values. Level switches in the surfactant canister provide the necessary alarms to indicate the fluid levels during operation.

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Ozone Stripping Option

Ozone Stripping Option

Ozonated water is used for the removal of organic compound, such as Photoresist and for clean cleaning wafers. Cleaning with ozone offers significant advantages when compared to the conventional wafer cleaning methods:

  • Elimination of toxic chemicals, such as sulfuric acids, hydrogen peroxide
  • Reduction in DI water consumption
  • Higher cleaning efficiencies
  • Smaller footprint
  • Environmentally Friendly

The ozone systems offered by UTE are applicable to both "batch" and "single" wafer processing. When used for Photoresist stripping, some mild chemical are sometimes added to achieve resist removal rates in excess of 10,000A/min of negative resist.

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Low Pressure Dispenses

Low Pressure Dispenses

UTE low pressure dispense nozzles can be configured for a wide variety of chemicals. All hazardous effluents are collected through a separate drain port. An optional chamber rinse feature is available for maintaining the cleanliness of the process chamber.

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Chemical Cart

Chemical Cart

Chemical carts are designed to hold, remove, and dispense liquids when chemical drains are not available in the cleanroom. High Level tank shutoff and a secondary containment can be added. Using an air-operated pump, the cart is easily transportable from the cleanroom to the chemical disposal area.

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