ProductsSubstrate ETCHing And Photoresist Stripping SystemsWafer, Photomask,
& Substrate
Cleaning Systems
Manual Cleaning
Systems
Automated Cleaning
Systems
Wet Bench / Batch
Cleaning Systems / Alcohol Vapor Dryer
Reionizers & Mixing
Systems
Covered Chuck Spin
Coaters
Photoresist
Developer Stations
ETCH AND STRIP SYSTEM

Ultra T Equipment Precision Cleaning and Substrate Processing Applications

PHOTOMASK CLEANING:

For optimal cleaning of photomasks (projection, Contact or Proximity printing), UtE offers a multitude of features on it’s equipment, configured specifically for each process. When photomasks are contaminated with positive photoresist, a low pressure dispense of stripper  is provided through an oscillating nylon bristle brush.  This surface conditioning step is followed by high pressure DI water and Megasonic cleaning. Drying is achieved by using hot DI water rinse and high speed spinning.

WAFER CLEANING:

Wafer cleaning is an important step, that is repeated several times during the manufacturing process. Ultra t Equipment (UtE) offers a variety of technologies for cleaning, etching, and stripping. The equipment is configured for each process application, such as:

  • Wafer Cleaning
  • Resist Stripping
  • Back side cleaning
  • Wafer Reclaim
  • Post CMP Cleaning
  • Pre-diffusion cleaning
  • Post Etch Cleaning
  • Cleaning after Dicing / Scribing
  • SU 8 Developing
Copyright © 2016 Ultra T Equipment Company, Inc., All Rights ReservedSite created by Thomas Web Solutions