Ultra T Equipment Precision Cleaning and Substrate Processing Applications

PHOTOMASK CLEANING:

For optimal cleaning of photomasks (projection, Contact or Proximity printing), UtE offers a multitude of features on it’s equipment, configured specifically for each process. When photomasks are contaminated with positive photoresist, a low pressure dispense of stripper is provided through an oscillating nylon bristle brush. This surface conditioning step is followed by high pressure DI water and Megasonic cleaning. Drying is achieved by using hot DI water rinse and high speed spinning.

WAFER CLEANING:

Wafer cleaning is an important step, that is repeated several times during the manufacturing process. Ultra t Equipment (UtE) offers a variety of technologies for cleaning, etching, and stripping. The equipment is configured for each process application, such as:

Wafer Cleaning
Resist Stripping
Back side cleaning
Wafer Reclaim
Post CMP Cleaning

Pre-diffusion cleaning
Post Etch Cleaning
Cleaning after Dicing / Scribing
SU 8 Developing