ProductsSubstrate ETCHing And Photoresist Stripping SystemsWafer, Photomask,
& Substrate
Cleaning Systems
Manual Cleaning
Automated Cleaning
Wet Bench / Batch
Cleaning Systems / Alcohol Vapor Dryer
Reionizers & Mixing
Covered Chuck Spin
Developer Stations

Manual Wafer, PhotoMASK, & Substrate Cleaning Systems

Ultra T Equipment manufactures manual single/double-sided cleaning systems and other related equipment for the semiconductor and microelectronic industries. Specializing in wafer, photomask and substrate cleaning, UTE utilizes single or double-sided high pressure DI nozzles, Atomizing Mist Nozzles, Brush, and Megasonic options.

Typical Cleaning Chamber

(click on thumbnail to enlarge)

Click to enlarge
Typical Cleaning Chamber
  1. Spindle (shown with chuck)
  2. Oscillating Nitrogen Blow-off Arm
  3. Fan Tip Nozzle
  4. Oscillating High Pressure Spray Arm
  5. Brush (optional)
  6. Megasonic Arm
  7. Heat Lamp (optional, not shown)
  8. Radial Down-draft Exhaust / Drain
  9. Chamber Liner
  10. Brush Height Adjustment Knob
Click to enlarge

UtE Model SCS112 Manual Cleaning System

Model SCS112 is a manual system, specifically designed for cleaning wafers after Dicing or Scribing. This cost efficient unit cleans wafers mounted on Hoops (Grip Rings) or Film Frames by applying High Pressure DI water jets or Atomizing nozzles. Rapid drying follows, using high spin speeds, nitrogen assist or Infrared Heat Lamps. The system is compatible with up to 8” wafers.


UtE Model SCSe Manual Cleaning System

Click to enlarge
Click to enlarge

Model SCSe Series Systems offer the ideal solution for submicron cleaning of Photomaks, Wafers and Substrates. The SCSe Systems can be configured with a variety of cleaning options ranging from high pressure or Megasonic nozzles, chemical dispenses, or heated DI Water. The Units could also be configured with several different chuck options for single substrate and multiple substrates orientations. Compatible with substrates up to 12” to 20” diameter depending on specific model.


UtE Model DCSe Manual Cleaning System

Click to enlarge
Click to enlarge

Model DCSe Series Systems are the recommended choice, when Double-sided cleaning is required. Excellent submicron cleaning of Photomasks, Wafers and Substrates is achieved by applying selected features, such as Megasonic, High Pressure or brush scrub. The Units could also be configured with different chuck options for single and multiple substrates orientations.  Compatible with substrates up to 20” to 29” diameter depending on specific model.


  Arms Available Maximum Substrate Size Max Spindle Speed Recipes Dispenses Brochure
SCS112 1 Up to 8" wafers 2500 Up to 3 1 PDF (37.2KB)
SCSe124 2 12" Diameter 2500 Up to 10 12 PDF (64.8KB)
SCSe126 4 12" Diameter 2500 Up to 10 12 PDF (69.7KB)
SCSe133 4 21" Diameter 2000 Up to 10 12 PDF (74.0KB)
DCSe606 2 20" Diameter 2000 Up to 10 12 PDF (66.0KB)
DCSe607 4 29" Diameter 1000 Up to 10 12 PDF (65.9KB)

Get Adobe Reader

Back to top

Copyright © 2016 Ultra T Equipment Company, Inc., All Rights ReservedSite created by Thomas Web Solutions