Manual Wafer, PhotoMASK, & Substrate Cleaning Systems

Ultra T Equipment manufactures manual single/double-sided cleaning systems and other related equipment for the semiconductor and microelectronic industries. Specializing in wafer, photomask and substrate cleaning, UTE utilizes single or double-sided high pressure DI nozzles, Atomizing Mist Nozzles, Brush, and Megasonic options.

SCS112	UtE Model SCS112 Manual Cleaning System Model SCS112 is a manual system, specifically designed for cleaning wafers after Dicing or Scribing. This cost efficient unit cleans wafers mounted on Hoops (Grip Rings) or Film Frames by applying High Pressure DI water jets or Atomizing nozzles. Rapid drying follows, using high spin speeds, nitrogen assist or Infrared Heat Lamps. The system is compatible with up to 8” wafers.
UtE Model SCSx Manual Cleaning System SCSe133 SCSe124 Model SCSx Series Systems offer the ideal solution for submicron cleaning of Photomaks, Wafers and Substrates. The SCSx Systems can be configured with a variety of cleaning options ranging from high pressure or Megasonic nozzles, chemical dispenses, or heated DI Water. The Units could also be configured with several different chuck options for single substrate and multiple substrates orientations. Compatible with substrates up to 12” to 20” diameter depending on specific model.
UtE Model DCSx Manual Cleaning System DCSe606 DCSe607 Model DCSx Series Systems are the recommended choice, when Double-sided cleaning is required. Excellent submicron cleaning of Photomasks, Wafers and Substrates is achieved by applying selected features, such as Megasonic, High Pressure or brush scrub. The Units could also be configured with different chuck options for single and multiple substrates orientations.  Compatible with substrates up to 20” to 29” diameter depending on specific model.

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