ProductsSubstrate ETCHing And Photoresist Stripping SystemsWafer, Photomask,
& Substrate
Cleaning Systems
Manual Cleaning
Systems
Automated Cleaning
Systems
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Cleaning Systems / Alcohol Vapor Dryer
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Covered Chuck Spin
Coaters
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ETCH AND STRIP SYSTEM

Manual Wafer, PhotoMASK, & Substrate Cleaning Systems

Ultra T Equipment manufactures manual single/double-sided cleaning systems and other related equipment for the semiconductor and microelectronic industries. Specializing in wafer, photomask and substrate cleaning, UTE utilizes single or double-sided high pressure DI nozzles, Atomizing Mist Nozzles, Brush, and Megasonic options.

Typical Cleaning Chamber

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Typical Cleaning Chamber
  1. Spindle (shown with chuck)
  2. Oscillating Nitrogen Blow-off Arm
  3. Fan Tip Nozzle
  4. Oscillating High Pressure Spray Arm
  5. Brush (optional)
  6. Megasonic Arm
  7. Heat Lamp (optional, not shown)
  8. Radial Down-draft Exhaust / Drain
  9. Chamber Liner
  10. Brush Height Adjustment Knob
 
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DCSe606

UtE Model SCS112 Manual Wafer, PhotoMASK, & Substrate Cleaning System

Model SCS112 is the ideal solution for submicron cleaning of Substrates including mounted Sawed/Scribed Wafers and other. This very reliable and cost effective system utilizes a proven High Pressure Water or Atomizing Mist Nozzle. The Rapid and Effective Drying technique uses High Spin Speeds and Nitrogen Assist. Compatible with up to 8" wafers.

 

UtE Model SCSe Manual Wafer, PhotoMASK, & Substrate Cleaning System

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DCSe607
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SCS112

Model SCSe Series Systems are ideal solutions for submicron cleaning of Photomasks, Wafers and Substrates. The SCSe Systems can be configured in variety of cleaning options. The Units can also be configured with several different chuck options for single substrate and multiple substrate orientations. Compatible with substrates up to 12" to 20" diameter depending on specific model.

 

UtE Model DCSe Manual Wafer, PhotoMASK, & Substrate Cleaning System

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SCSe124
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SCSe133

Model DCSe Series Systems are ideal solutions for submicron cleaning of Photomasks, Wafers and Substrates. The DCSe Systems can be configured with a variety of cleaning options from single to double sided. The Units can also be configured with several different chuck options for single substrate and multiple substrate orientations. Compatible with substrates up to 20" to 29" diameter depending on specific model.

 

  Arms Available Maximum Substrate Size Max Spindle Speed Recipes Dispenses Brochure
SCS112 1 Up to 8" wafers 2500 Up to 3 1 PDF (37.2KB)
SCSe124 2 12" Diameter 2500 Up to 10 12 PDF (64.8KB)
SCSe126 4 12" Diameter 2500 Up to 10 12 PDF (69.7KB)
SCSe133 4 21" Diameter 2000 Up to 10 12 PDF (74.0KB)
DCSe606 2 20" Diameter 2000 Up to 10 12 PDF (66.0KB)
DCSe607 4 29" Diameter 1000 Up to 10 12 PDF (65.9KB)

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