Model ECC
123 - Extended Capabilities Cleaner
DESCRIPTION:
The highly efficient Model ECC123 is the ideal
solution for submicron cleaning of Photomasks, Wafers and Substrates. The very reliable and
cost effective system utilizes a proven High Pressure De-ionized Water Spray with optional
Fixed or Oscillating Surfactant Dispenses and a Brush, that incorporates Self Cleaning.
The Rapid and Effective Drying technique
combines Variable Spin Speeds with Nitrogen Assist and a Heat Lamp. The System also makes available
a Photoresist Stripper option. The ECC123 has a Microprocessor Controller allowing
variable process parameters and retention of
multiple process programs in
memory.
FEATURES:
- Compatible with Substrate of Up to 10
Inches
- Programmable Microprocessor Controlled
Process
- Oscillating High Pressure D.I. Water Jet, of
up to 2500 PSI, having 0.2 µm Filtration for Effective
- Three (3) Adjustable Spin Speeds
- N2 Drying Assist with 0.02 µm
Filtration
- Infrared Heat Lamp for Complete Drying
- Efficient Radial Chamber Combined Exhaust
/Drain
- Built-in Exhaust Blower for Consistent
Results
- D.I. Water Line Purge for a Bacteria Free
System
- Built-In Safety Interlocks
OPTIONS:
- Various sizes of vacuum chucks for wafers
- Adjustable Self Cleaning Brush Assembly
having Up-to Two Dispenses and Nylon Brush Material
- CO2 Re-ionizer for Elimination of
Static Charge
- Fixed or Oscillating Low Pressure Dispenses
- Surfactant Dispense Canisters
- 0.2 µm Filtration for Low Pressure
Dispenses
- Photoresist Stripper Conversion
- Nitrogen Ionizer
- Ocillating Megasonic DI Water Dispense
Arm