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ETCH AND STRIP SYSTEM

Covered Chuck Spin Coaters

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UtE SC-Series Covered Chuck System

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UtE SC-Series Covered Chuck System
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UtE SC-Series Covered Chuck System

The SC-Series, equipped with a specially designed covered chuck system, is the optimal tool for uniformed coatings. Turbulence-related non-uniformities such as streaks, comets, striations, and splatters are eliminated. The consumption of Liquid Film Chemicals is greatly reduced, with a 70% reduction demonstrated in some applications. Ideal for applications with square, rectangular or irregularly shaped substrates, the SC-23 will uniformly coat into corners with no discernible edge bead. The covered chuck system eliminates the need for nested chucks and its associated backside contamination and particulates. The SC-23 is suited for Flat Panel Display, photomask, wafer, GaAs, leading edge MultiChip Module, advanced Printed Wire Board and PCB applications.

 

On the Classical Spin Coater

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Classical Spin Coater Diagram
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Classical Spin Coater Diagram 2

On the Classical Spin Coater, the air immediately above the spinning chuck will be accelerated outward. This air then encounters the wall of the catch cup and is partially deflected upward where it can be entrained by the swirling air vortex above the chuck, to be drawn back down to the surface of the chuck. This creates a problem. In that droplets of resist are also entrained in this air flow path, causing these resist droplets to be flung back onto the spinning chuck surface to cause resist splatters.

On the Classical Spin Coater, the resist, as it spreads, moves in a spiral path relative to the Substrate. Due to the High Chuck Acceleration and Speeds and the Inertia of the resist puddle, the spreading resist puddle moves at a slower spin speed than the chuck. In addition, the spreading resist puddle also experience a drag force from the air above it, further slowing the resist puddle relative to the chuck.

 
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Covered Chuck Spin Coater Diagram

Ultra t Equipment's Covered Chuck Spin Coater

On Ultra t Equipment's Covered Chuck Spin Coater, the resist, as it spreads, moves in a RADIAL path relative to the Substrate. The low spin speeds and acceleration means that the spread resist puddle will move with the substrate at the same rotational speed. As the top parallel plate spins synchronously with the chuck, it accelerates the air above the chuck to the same speed as the chuck, so there is no drag force on the spreading resist puddle. The resist puddle therefore spreads radially relative to the substrate. As the spreading Resist Puddle moves radially relative to the substrate and not in a spiral path, of the substrate and not in a spiral path, nesting of the substrate in the chuck is not necessary on the Covered Chuck. This eliminates the particles caused by nested chucks.

 

Parameter Classical Process Covered Chuck Process
Speed 2500 rpm 700 rpm
Acceleration 5000 rpm/sec 500 rpm/sec
Spin Time 32 sec. 18 sec.
Thickness* 1.4 micron 1.4 micron
Uniformity** ±30.0% ±2.0%
Dispensed Volume 30cc 7cc

 

Models Arms Available Maximum Substrate Size Max Spindle Speed Acceleration Recipes Dispenses Brochure
SC-9 2 9" on the Diagonal 10 to 1000 RPM +/- 1 RPM 750 RPM/s Up to 10 5 PDF (53.4KB)
SC-13 2 13" on the Diagonal 10 to 1000 RPM +/- 1 RPM 750 RPM/s Up to 10 5 PDF (71.8KB)
SC-23 2 23" on the Diagonal 10 to 1000 RPM +/- 1 RPM 750 RPM/s Up to 10 5 PDF (45.4KB)

**Note: Max Speed and Acceleration may vary depending on substrate

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