ProductsSubstrate ETCHing And Photoresist Stripping SystemsWafer, Photomask,
& Substrate
Cleaning Systems
Manual Cleaning
Systems
Automated Cleaning
Systems
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Reionizers & Mixing
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Covered Chuck Spin
Coaters
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ETCH AND STRIP SYSTEM

Automated Wafer, PhotoMask, & Substrate Cleaning Systems

ULTRA T Equipment manufactures automated single/double-sided cleaning systems that can be configured with many options.

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UtE CCSe Series Automated Cleaning System

UtE CCSe Series Automated Cleaning System

The highly efficient CCSe series is the ideal solution for submicron cleaning of Photomasks, Wafers and Substrates in a cassette to cassette format. The cleaning chamber can be equipped for processing multiple substrates at once, in either a single or double-sided configuration. The cleaning chamber utilizes proven assortment of cleaning technologies. The CCSe can be configured with several different cleaning options form High Pressure DI, Atomizing Mist Nozzle, Brushes, Megasonic Pies and Nozzles, and much more. The Rapid and Effective Drying technique combines Variable Spin Speeds optional Heated DI, Nitrogen Assist or Heat Lamp.
 
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UtE MSCS Series Automated Cleaning System

UtE MSCS Series Automated Cleaning System

The high throughput Automated model MSCS is the solution for customers that require submicron double-sided cleaning of Photomasks, Wafers and Substrates. The MSCS uses Genmark’s Robot Transfer platform which can feed up to three cleaning modules. Most cleaning applications are performed in a class 1 minienvironment. The cleaning modules could be configured with different cleaning options ranging from High Pressure DI, Atomizing Mist Nozzle, Brushes, Megasonic Pies and Nozzles, and much more. The Rapid and Effective Drying technique combines Variable Spin Speeds, optional Heated DI dispenses, Nitrogen Assist or Heat Lamp. The MSCS has a Microprocessor Controller allowing variable process parameters and retention of multiple process programs in memory.

 
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UtE SCSe Series Automated Cleaning System

UtE SCSe Series Automated Cleaning System

The Automated SCSe offers optimized process performance and low cost, for submicron cleaning of Photomasks, Wafers and Substrates in a cassette to cassette format. The robot transfer station can accommodate up to three cleaning modules. The very reliable and cost effective cleaning modules utilizes proven assortment of cleaning technologies. The SCSe can be configured with several different cleaning options form High Pressure DI, Atomizing Mist Nozzle, Brushes, Megasonic Pies and Nozzles, and much more. The Rapid and Effective Drying technique combines Variable Spin Speeds optional Heated DI, Nitrogen Assist or Heat Lamp.
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